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Semiconductor cleanrooms

Core Parameters of Semiconductor Cleanroom
ISO 14644 Cleanroom Class: ISO 1–7 (Typical Fab: ISO 3–5)SEMI Standards Compliance (SEMI S2 / S8 / F21, etc.)
HEPA / ULPA Filtration: H14–U16, ≥99.995% @ MPPSUnidirectional / Non‑Unidirectional Airflow Design (Laminar / Turbulent)
Air Change Rate (ACH): 200–600+ for Critical Process AreasTemperature Control: 20–24 °C, ±0.5 °C; Humidity: 40–55% RH, ±5% RH
Pressure Differentials: 10–30 Pa Between Zones (Cascade Design)Airborne Molecular Contamination (AMC) Control: Acid/Base/Organic Filters
ESD Control: Conductive Flooring, Grounding, Ionization SystemsVibration & Noise Control: Tool Pads and Low‑Vibration Structural Design

Fast, Integrated Semiconductor Cleanroom Design & Build Partner.

20+ Years,                           1M+ m² Cleanrooms        
300+ Fabs
Front-end & back-end semiconductor projects delivered.
Top
Trusted by leading global IDMs & foundries.

Applicable industries and scenarios

Tackle the toughest semiconductor cleanroom challenges—from extreme contamination control and AMC mitigation to ultra-stable temperature, humidity, and vibration environments for advanced nodes.

Particle contamination icon

Particle & AMC Contamination

Nanoscale particles and airborne molecular contamination (AMC) from tools, chemicals, and people cause pattern defects and yield loss. Deiiang combines ULPA/HEPA, AMC filtration, optimized airflow, and zoning to keep ISO Class 3–5 areas in tight control.

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Environmental Stability & Yield Drift

Small temperature, humidity, or pressure fluctuations shift CD, overlay, and film properties at advanced nodes. Our data-driven HVAC design, cascade pressure schemes, and precise controls deliver ultra-stable environments with integrated monitoring.

Vibration control icon

Tool Vibration & Lithography Sensitivity

External vibration and structural resonance degrade scanner performance, causing line-edge roughness and overlay errors. Deiiang uses vibration-isolated slabs, structural damping, and optimized tool pad design to protect critical lithography bays.

ESD icon

Electrostatic Discharge (ESD) Failures

Charge buildup on floors, tools, and operators silently damages sensitive devices, driving up latent failure rates. Our ESD-safe flooring, grounding networks, ionization systems, and procedures form a complete ESD control solution for fabs.

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Cross-Zone Airflow & Pressure Control

Mismanaged pressure cascades and airflow patterns pull contamination from grey to ultra-clean zones. Deiiang engineers room classifications, door schemes, and active pressure control to maintain robust cascades and prevent backflow events.

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Compliance & Continuous Monitoring

Meeting ISO 14644, SEMI, and customer audits is difficult without reliable data and documentation. We provide integrated particle, AMC, and environmental monitoring, alarm management, and full IQ/OQ/PQ documentation to streamline compliance.

Our Semiconductor Cleanroom Solution

Cleanroom Engineering

Process-Driven Cleanroom Engineering

We design semiconductor cleanrooms starting from your process flow, tool set, and yield targets, ensuring every bay, chase, and sub‑fab area supports stable, scalable production.

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  • Fab / sub‑fab integration for tools, utilities, and service corridors

  • ISO 14644 & SEMI compliant layouts for front‑end and back‑end fabs

  • BIM & CFD‑validated airflow and capacity planning

Semiconductor production.webp
AMC Control

Advanced Contamination & AMC Control

Deiiang engineers filtration and airflow based on real fab risks, combining particle, AMC, and ESD control to protect critical steps like lithography, etch, and deposition.

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  • HEPA / ULPA filtration up to ISO Class 3 for critical areas

  • AMC filters targeting acids, bases, and organic contaminants

  • ESD‑safe materials, flooring, and grounding systems

Semiconductor cleanroom maintenance.webp
Energy Optimization

Precision Environment & Energy Optimization

We balance ultra‑tight temperature, humidity, and pressure control with long‑term operating cost, using data‑driven HVAC design and high‑efficiency equipment selection.

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  • Stable temperature and humidity for sensitive process tools

  • Pressure cascade zoning for clean and grey areas

  • High‑efficiency FFUs and VAV control for energy savings

Semiconductor Cleanroom HVAC + AHU System.webp
Modular Construction

Modular Construction & Fast Ramp-Up

Using prefabricated modules and standardized interfaces, Deiiang shortens construction, simplifies tool hook‑up, and leaves a clear path for phased capacity expansion.

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  • Modular walls and ceilings for rapid installation

  • Flexible bay‑and‑ballroom cleanroom layouts

  • Tool hook‑up ready utilities and interfaces

Modular assembly cleanroom completion effect.webp
Compliance, Validation

Compliance, Validation & Lifecycle Service

Our team supports qualification, audits, and ongoing optimization with documented procedures, periodic testing, and long‑term maintenance to keep your fab within spec.

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  • IQ / OQ / PQ and ISO 14644 cleanroom testing

  • SEMI and EHS documentation for audits and approvals

  • Preventive maintenance and performance monitoring plans

IQ : OQ : PQ and ISO 14644 cleanroom testing.webp

Technical Resources

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Fast, Integrated Semiconductor Cleanroom Design & Build Partner.

20+ Years,                           1M+ m² Cleanrooms        
300+ Fabs
Front-end & back-end semiconductor projects delivered.
Top
Trusted by leading global IDMs & foundries.

Design Review and Approval Ensure the design meets all required specifications. Site Preparation Prepare the location for installation, including structural supports and HVAC infrastructure. Cleanroom Structure Construction Install walls, ceilings, floors, and doors using the specified materials. HVAC and Filtration Systems Install HEPA/ULPA filters, air ducts, and ventilation systems to ensure proper airflow and contamination control. System Testing and Calibration Verify that all systems (temperature, humidity, airflow) are working as designed. Final Inspection and Certification Ensure compliance with international standards such as ISO 14644-1 before the cleanroom is operational.

Learn more about Deiiang cleanrooms
Frequently Asked Questions (FAQ)
What is a cleanroom in semiconductor?

Also referred to as fab (short for fabrication) rooms, cleanrooms are specially constructed facilities where semiconductors are fabricated and manufactured. Pollutants at the nanometer level can potentially affect the functionality and quality of the semiconductor. The International Organization for Standardization (ISO) classifies cleanrooms based on the maximum number of allowed particles of 0.5 μm or larger in a cubic meter of air. ISO class 1 cleanrooms allow no more than 1 particle. The semiconductor fabrication facilities are equipped with sophisticated filtration systems and environmental control systems to meet the requirements of ISO class 1. Personnel are required to wear protective clothing and gear to minimize any potential contamination.

Why are semiconductors fabricated in a clean room?

Many of the processes in semiconductor fabrication are very sensitive to the presence of particles. The type of control and cleanliness of a semiconductor fabrication environment is comparable to that of a biological laboratory. In order to fabricate smaller and more sophisticated semiconductor devices, more advanced controlled environments are necessary.

What is a "clean room" for microprocessors?

A microprocessor is a type of semiconductor device; therefore, the same type of environments are required for the fabrication of microprocessors. Additional controls and a more rigorous environment are required for the construction of microprocessors because microprocessors are fabricated using more advanced processes (i.e. photolithography).

What does CIP mean for semiconductors?

Critical Infrastructure Protection (CIP) for semiconductors describes the systematic, defensible, and manageable assurances to protect cleanroom and associated semiconductor fabrication equipment environments from security, availability, and integrity threats. CIP semiconductor fabrication revolves around the protection of the environmental system which incorporates a host of processes and systems to monitor and manage the cleanrooms.

What are the conditions for building a semiconductor cleanroom?

Environmental conditions in semiconductor cleanrooms are controlled extremely tightly. These cleanrooms are designed to achieve ISO class 1-5. These classes are further defined by filtration standards of either HEPA or ULPA. In addition to filtration, control of temperature, humidity and positive pressure are essential to control contamination. Staff is required to strictly enforce procedures for control of air movement and pollution. Additional procedures are designed to maintain personnel hygiene.

What are the standards for semiconductor cleanliness?

The standards for cleanliness of semiconductor cleanrooms are defined in the ISO 14644 series. These standards define cleanliness in terms of the concentration of airborne particles of 0.5 microns or less. The semiconductor industry uses classes 1-5 to define cleanliness. The standards define permissible limits of particles and provide guidance for design and use of facilities and processes for semiconductor fabrication.

What are the standards for temperature in a semiconductor cleanroom?

The standards for temperature in a semiconductor cleanroom is 20-22°C. Temperature control is extremely important to processes such as lithography and etching. Process control equipment is very sensitive to temperature changes. Rapid changes in room temperature can promote the formation of condensation.

How are "clean" rooms classified?

"Clean" rooms, or more properly stated, "controlled" rooms, classifications are based on the number of airborne particles that are 0.5 microns and larger. From the smallest to the largest, "clean" rooms are classified as follows: Class 1 through Class 9. Each classification has a maximum allowable number of particles which is cubed per unit. Most industries that require the use of "clean" rooms are the manufacturing of micro semiconductors, pharmaceuticals and aerospace.

What is a semiconductor "clean" room?

A semiconductor "clean" room is a fabricated environment designed to manufacture and/or test integrated circuits and semiconductors. "Clean" rooms incorporate controls that maintain and/or reduce airborne particles and a strict control of a number of variables, including but not limited to humidity, temperature and static electricity. "Clean" rooms utilize HEPA/ULPA filtration.

What is a Class 7 or 8 "clean" room?

Class 7 and 8 "clean" rooms are the most prevalent of all classifications and allow a higher number of particles per unit cubed when compared to higher classifications. Class 7 allows 352,000 particles and Class 8 allows 3,520,000. Electronic component assembly requires Class 7 "clean" rooms. The assembly of less critical components allows for a higher number of particles. Class 7 and 8 "clean" rooms are not suited for the manufacturing of semiconductor chips.

What is the applicable ISO standard for a semiconductor "clean" room?

For the semiconductor industry, the applicable standard is ISO 14644-1. Class 1 to 5 are required for the manufacturing of integrated circuits and chips. Other complementary standards include ISO 14644-2 for performance evaluation, ISO 14644-3 for sampling and ISO 14644-4 for design, and construction of "clean" rooms.

What is the minimum standard for a cleanroom?

The minimum standard for a cleanroom is the control of particulates coupled with control of the environment. Minimum standards also include adequate air changes and positive air pressure. Hard surface walls and floors are smooth and non-absorptive. Personnel are fully gowned and protected.

What is a Class 2 cleanroom?

A Class 2 cleanroom is considered a low-to-moderate standard environment. A Class 2 cleanroom allows 1,000,000 particulate concentrations (0.5 microns and larger) per cubic meter. A Class 2 cleanroom is adequately controlled for low risk, moderate precision processing and electronic parts assembly and is also used for simple pharmaceutical processing.

What is a Class 6 cleanroom?

A Class 6 cleanroom is slightly better controlled than a Class 7 and slightly worse controlled than a Class 5. A Class 6 cleanroom permits 500,000 (0.5 micron) particulate concentrations per cubic meter. A Class 6 cleanroom is used for low risk precision processing and electronic part assembly, and simple pharmaceutical processing. A Class 6 standard would not be appropriate for the processing and fabrication of semiconductor devices.

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